Previous Research
Direct Writing of Electronic Components

The fabrication of a modern microprocessor requires hundreds of steps for creating and connecting all the components. Multiplexed direct deposition of conducting materials merges lithography and synthesis in a single process and eliminates the need for difficult registry. Recently, AFM lithography was used to pattern graphitic nanowires with velocities as high as 1 cm/s. In this project, we integrate these wires in devices to measure their electrical properties and expand the scope of this technique to traditional semiconductors (Si, Ge) and III-V compounds.