A Short Course in ...
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The course is designed for industrial researchers, engineers and technicians dealing with surfactants, thin films, coatings, natural and synthetic fibers, adhesives, lubricants, wetting agents, foams, pigments, powders, drug delivery media and other materials for which surface properties play an important role. Such systems play critical roles in many fields: chemical industry, chemical engineering, food science, material science, agriculture and medicine, etc.
As the dimensions of material systems are driven into the micro and nano size domains, new kinetic, mechanical, electrical, optical, rheological, and other properties emerge. These are critical in chemical processing, drug development and delivery systems, material science, food technology, magnetic data storage technology, imaging technology and much more. Not only are present-day processes for fluid and fluid-solid system handling (coating, spraying, spinning, foaming, wicking, etc.) controlled by capillary and other interfacial phenomena, new techniques, instrumentation and understanding are leading to breakthroughs from micro and nano-fluidics, to "lab-on-a-chip" (LOC) systems, to micro electromechanical systems (MEMS), etc. The science underlying the present and the emerging technologies is presented in this course. The consequences are traced to industrial practice and everyday experience. Finally, the most up-to-date techniques and experimental instrumentation for property measurement and system characterization are demonstrated.
Professor John C.
Berg.
Rehnberg Professor of Chemical Engineering
University of Washington
Dr. Berg is a Professor of Chemical Engineering at the University of Washington and Director of the Center for Surfaces, Polymers and Colloids. He has pursued a research program in surface and colloid science over the past twenty-five years and has published over 170 research papers in the area. His recent and current research includes wicking flows, adhesion, flocculation of drug-laden vesicles, electrosteric stabilization of colloids, paper recycling and foam stability. He was the recipient of a J. S. Guggenheim Fellowship for the study of Interfacial Phenomena (at the Swiss Federal Institute of Technology, Zurich), received the University of Washington Outstanding Teaching Award, and has been given the Alpha Chi Sigma Award, a national award for Chemical Engineering Research.
The course consists of lectures in the mornings, which develop the fundamentals and trace their consequences into industrial practice, and laboratory demonstrations in the afternoons, which illustrate modern methods of investigating and characterizing surface and colloid systems.
Laboratory demonstrations are presented by Ph.D. students in the Department of Chemical Engineering at the University of Washington, and by representatives from several instrument manufacturing companies.
Participants will receive a detailed text (approx. 600 pp.), prepared for this course, covering all of the lecture material presented, and more.
MONDAY
Morning
Afternoon
Laboratory demonstrations, including:
TUESDAY
Morning
Catered Luncheon at Ivar's Salmon House
Afternoon
Laboratory demonstrations, including:
WEDNESDAY
Morning
Afternoon
Laboratory demonstrations, including:
THURSDAY
Morning
Afternoon
Laboratory demonstrations, including:
FRIDAY
Morning
Course ends at 12:00 Noon
The course will be held in a University of Washington classroom and in laboratories in Benson Hall. Session times are 8:30 a.m. to 5:00 p.m. Monday through Thursday and 8:30 a.m. to noon on Friday. More information will be specified in your confirmation letter.
To find lodging near the university or on-campus residence halls accommodations, go to: HOUSING
Consistently rated among the nation's most livable cities, Seattle is known for its scenic beauty, temperate climate and abundant cultural and recreational opportunities. Just north of downtown Seattle, the University of Washington campus occupies 684 acres bordering Lake Washington and is host to 35,000 students. Seattle-Tacoma International Airport is located 30 minutes south of campus and services international as well as nonstop domestic flights from all major U.S. cities.
Course participants will earn 3.0 continuing education units. The CEU is a nationally recognized measure of participation in a continuing education program that meets established criteria for increasing knowledge and competency.
The registration fee for this course is $1475 (U.S.) if received by July 5, 2005 and $1550 after that date. The fee includes the textbook, instruction, one luncheon at Ivar's Salmon House, all refreshment breaks, and a certificate for 3.0 continuing education units (CEUs). A confirmation letter with a map and additional information will be sent upon receipt of your registration.
If you enroll and cannot attend, a refund of the registration fee less $100 will be granted if requested in writing and postmarked by July 5, 2005. After that date a total of $200 will be deducted from your refund. No refunds will be granted to registrants who fail to cancel prior to the opening of the course. If you are unable to attend you may send another person in your place.
Campus parking is available, if needed, at an additional cost of $9.00 per day paid at any University entrance.
FAX: (206) 543-2352
E-MAIL: uw-epp@engr.washington.edu
You may register by telephone using VISA or MasterCard by calling Engineering Professional Programs toll-free at 1(866) 791-1275.